Welcome to our research group

It’s a pleasure to have you on our website. Our lab is involved in the study of integrated nanoelectronic devices and circuits, with particular focus on 3D integration and memory technology. We aim to be a beacon and a catalyst in the scientific community and society, never settling for the status quo. As the leader of this team, I invite you to explore our website, interact with our group members, and share your research interests with us. We appreciate your visit.

Seunghyun Lee, Ph.D.

• Congratulations to Junseong, Hyeyoon, Dohee, on the publication of their paper in Advanced Materials!

• Congratulations to Junho Bae and Yuseop Shin on the publication of their paper in Nature Communications!

• Samsung Electronics industry-academic project begins in 2022. (Ultra-thin 3D integration process and nTnR technology development)

• PIM artificial intelligence semiconductor core technology development project begins in 2022. (Development of PIM devices, circuits, and architecture based on high reliability resistance variable memory (ReRAM))

• IITP project begins in 2022. (Development of CXL-based PIM semiconductor technology for multiple DRAM modules considering memory consistency)

• Batyrbek student, congratulations on publishing in Nature Partner Journal (2021).

• Intelligent semiconductor business project begins in 2020 (Development of ReRAM-based near-memory bit vector operator)

• Participation in the system semiconductor manpower training project and Brain Korea manpower project begins in 2020

• Participated in university key research institute project in 2018 (research on convergence energy autonomous multi-functional sensor platform)

• Industrial technology innovation project started in 2018 (development of neuromorphic system to overcome 3D memristor array shortcomings)

• LG Display industry-academic project started in 2017 (ultra-small pixel microLED display production technology)

• Gov project started in 2017 (Radiation-resistant integrated device, 2017M1A7A1A01016262).

• Emerging basic research project started in 2017 (research on improving reliability of gallium nitride (GaN) semiconductor devices using anisotropic heat transfer characteristics).

We want passionate MS-PhD, PhD students and Postdocs. Please send me your resume, picture, transcript, and 1 page Statement of Purpose. Requires good communcation skill.

• Area 1: 3D integration, CMOS integration, chip-level packaging
  

• Area 2: Nanoscale heat management in electronics
  

• Area 3: Novel Memory Technologies (3D memories, DRAM, Ferroelectrics, Memristors)