Career Highlights

• 2024 Commitee member and Writer of National Semiconductor Roadmap (3D-integration section).
  

• 2024 PI for Artificial Intelligence (AI) Semiconductor Human Resource Development Project, Kyung Hee University.
  

• 2024 Dept Head, Dept of Semiconductor Engineering.
  

• 2024 Research collaboration with Samsung Electronics, published in Advanced Materials.
  

• 2022 Gov. project, ‘Next-Generation Intelligent Semiconductor Technology Development’, received commendation for excellent result.
  

• 2022 Research collaboration with LG, published in Nature Communications.
  

• 2021 Invited talk at Samsung Electronics, XNOR-net based neural network
  

• 2020 World’s thinnest memory, international patent registered
  

• 2016 Postdoc Research Featured in Stanford University News
  

• 2015 3D vertical memory research published in Nature Comm.
  

• 2012 Material Research Society (MRS) Gold Award.
  

• 2012 Doctoral research published in Nature Comm. introduced as Editor's choice in Science.
  

• 2012 PhD research featured in University of Michigan News.
  

• 2012 University of Michigan Engineering Symposium (1st place in solid state physics)
  

• 2011 American Vacuum Engineering Society (AVS Spring) Best Poster Award.
  

• 2010 Michigan Graduate School Research Scholarship Award.
  

• 2008 1st place in the Analog circuit design competition hosted by Texas Instruments
  

• 1998-2000 Seoul National University undergraduate scholarship.
  

Research Projects

• 2025 Industry-academic Project. (Development of a novel material sensor that mimics the thermal denaturation phase transition of biomaterials and an electronic tag for pharmaceutical monitoring)

• 2024 Public-Private Joint Investment Semiconductor Industry Technology Innovation Project (Development of a high-selectivity, high-reliability, and selective element for PIM-oriented crosspoint SOM applications.).
  

• 2024 Artificial Intelligence (AI) Semiconductor Human Resource Development Project(PI).
  

• 2024 BK21 Global Advanced Semiconductor Innovation Education and Research Group.
  

• 2023 Samsung Electronics industry-academia project (Post-Cu interconnect technology based on crystalline carbon and Ruthenium).
  

• 2022 Samsung Electronics industry-academia project (ultra-thin 3D integration process and nTnR technology development).
  

• 2022 Ministry of Science and ICT Information and Communication and Broadcasting Technology Development Project (Development of CXL-based PIM semiconductor technology for multiple DRAM modules considering memory consistency).
  

• 2022 PIM artificial intelligence semiconductor core technology development project (development of high-reliability resistance change memory-based PIM devices, circuits, and architecture)

• 2021 Next-generation semiconductor technology development project (Development of ReRAM-based near-memory bit vector operator).
  

• 2020 BK21 Participated in the 4th stage.
  

• 2020 Participated in the 2020 System Semiconductor Human Resources Development Project.
  

• 2018 Industrial Technology Innovation Project (Development of neuromorphic system to overcome 3D memristor array shortcomings)
  

• 2018 Reselected for the 2nd year of the 2018 LG Display Industry-Academic Project.
  

• 2018 Participated in the 2018 Science and Engineering Academic Research Support Project (research on convergence energy autonomous multi-function sensor platform).
  

• 2017 LG Display Industry-Academia Project (ultra-small pixel GaN microLED display production technology)
  

• 2017 Gov Project (Development of radiation-resistant integrated devices based on wide band gap and functional materials).
  

• 2017 Emerging Basic Research Project (Research on improving the reliability of gallium nitride (GaN) semiconductor devices using anisotropic heat transfer characteristics).